ME10 SoC - 4K AV over IP System on a Chip
The ME10 SoC is Macnica’s full-stack AV over IP system on a chip (SoC), transporting HDMI 2.0 4K 4:4:4 video, audio and control data over 1GbE networks in a small, 23 x 23 mm BGA package.
Like our MPA1000, the ME10 allows manufacturers to include IPMX interoperability in any video product with a minimal investment in engineering. But the ME10 is ideal for larger production runs or for use in more compact products.
IPMX: The Open AV over IP Standard
The ME10 is ready for AIMS IPMX, the collection of open standards and specifications for AV over IP developed specifically for the pro AV market.
With standards for interoperability that include device discovery and registration, USB and serial extension, resilient network performance, subframe latency, and JPEG-XS compression, IPMX is the standard that the industry has been waiting for.
The ME10 builds on this interoperable platform to give you a complete AV over IP solution for all of your product lines. The included web stack features a HTTP configuration API, which provides complete access to the ME10’s capabilities. The customizable web interface is clean and intuitive. JPEG-XS compression provides a truly immersive and transparent desktop experience.
For manufacturers with high volume ProAV applications, the ME10 makes it easy to start your next project. Because the ME10 is the SoC at the heart of the MPA1000 module, the same development kit is used for both components. This gives you more flexibility and dramatically reduces the cost of adoption.
Demand for AV over IP standards means IPMX. The ME10 SoC gives you the power to meet that demand with the performance and flexibility that your customers expect.
ME10 SoC Features:
- Low-latency synchronized transport based on AIMS IPMX open standard combining SMPTE ST 2110, AMWA NMOS and JPEG-XS compression standards
- AES128 Encryption
- HTTP API and Lua scripting environment
- Web UI
- HDMI 2.0 Tx or Rx (unidirectional)
- USB 2.0 (encrypted)
- 2 x UART
- 2 x I2C
- microSD Card or eMMC memory
- 32 bit DDR3
- Serial FLASH
- 3 x CLK
- Package Information
- 23 x 23 mm Flip-Chip BGA (484 pins)